With its large wafer production capacity, technological innovation in manufacturing and process, and the pursuit of the highest quality, Hynix is now leading industry efforts to develop next generation DRAM products. Significant investments in R&D has given Hynix a head start in the development of very high density DRAMs in small packages that enable the design of unique end-use applications. Currently, Hynix offers a full range of products from 4M to 1Gb with DDR, DDR2 and DDR3 interfaces. A family of Graphic DRAMs(GDDR3 and GDDR4) are also available. Hynix also offers low-power DRAM products optimized for use in mobile applications such as cell phones.
Hynix also offers a wide range of memory modules for PCs, notebooks and servers. Through its global manufacturing and sales support network, Hynix has emerged as a leading DRAM supplier to major OEMs worldwide. Hynix plans to continue its industry leading development of new products and technologies to meet industry requirements.
Hynix Semiconductor has become one of the leading companies in NAND Flash memory market through constant product development and aggressive marketing since our NAND business started in 2004.
Hynix provides not only NAND Flash components for removable data storage device such as Memory stick, MMC, SD, CF, xD Picture Card and USB flash Drive, but also the total NAND Solution for many kinds of digital applications such as MP3 player, PMP, Digital still camera, Digital camcorder, portable and desktop computer and mobile phones through MCP, DOC (Disk on chip) and Embedded Flash Drive technology.
Currently Hynix offers both SLC(Single-level cell) and MLC(Multi-level cell) products with a broad range of densities from 128Mb to 64Gb. Furthermore, Hynix tries to mass produce in various package types such as TSOP, USOP, FBGA, LGA and etc to meet various customers' requirements. Hynix semiconductor will not take satisfaction on the present position in NAND Flash business, but will do our utmost to fulfill customers' needs with providing the high quality products and services through continuous technology development and productivity improvement.
Hynix Semiconductor, in order to catapult its status as the foremost specialist in the area of semiconductor in the world, has been fortifying its portfolio through re-entry into the non-memory area since 2007. CIS (CMOS Image Sensor), the first project of the company for this purpose, is the area with closest link with the existing memory semiconductor technology. Rapid growth on the foundation of the technological competitiveness the company has been accumulating is anticipated.
CIS is an imaging device that plays the role of a type of electronic film in digital apparatus. CIS products that Hynix will be manufacturing will be supplied to broad range of areas including camera phone, web-camera, small imaging device used in medical applications.
Ceaseless efforts of Hynix towards supplying of products that our clients want, on the foundation of ultramicro nano technology, shall open new horizon in the area of CIS.
