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Computing Memory

DDR3 SDRAM
COMPONENT : 1Gb | 2Gb | 4Gb
MODULE : UBDIMM | SODIMM | VLP RDIMM | RDIMM
DDR2 SDRAM
COMPONENT : 512Mb | 1Gb | 2Gb | 4Gb
MODULE : UBDIMM | FBDIMM | VLP RDIMM | RDIMM | SODIMM
DDR SDRAM
COMPONENT : 128Mb | 256Mb | 512Mb
MODULE : UBDIMM | RDIMM | SODIMM

Computing Memory
General Description
Users now demand a powerful, full-featured mobile system, with low power consumption, extended battery life and connectivity. There is a lot of concern about protecting the environment and it is quickly becoming one of the top priorities. Highly virtualized applications such as data centers, servers and supercomputers, could take advantage of the low power features of the DDR3 SDRAM to enable cooler, power efficient systems. Hynix is responding to the industry demand for eco-friendly or 'green' products that reduce power consumption, utility expenditures, improve reliability and reduce carbon emissions. The new Hynix 1.5V 1Gb DDR3 features 25% lower power consumption than legacy or competing solutions. The 1.35V product will yield an additional 20% power savings. It will be an attractive solution for applications requiring compliance to energy star specifications. This product would also be ideal in mobile applications, such as Notebooks, where it markedly extends battery life. The new design philosophy adopted on the second generation 1Gb DDR3, will also be applied to future high density DRAM components from Hynix. The new 44nm process along with Hynix¡¯s design optimization and internal signaling innovations, reduces power consumption and enhances performance. Devices operating at 1.5V and 1.35V (Low Voltage) exhibit similar performance characteristics. The demand for low power consumption in both mobile system like notebooks and server systems such as datacenters, is the emerging trend. Hynix¡¯s strategy is to satisfy customers needs for reduced power consumption and improved performance with technology advancements such as this 40nm class product.

Application Transition to Notebook

Notebook PortionA crossover to mobile computers from the traditional desktop has already occurred. Declining prices is the primary driving factors, especially in light of the current global economic conditions. Mobility and weight are other features that make mobile computers attractive to consumers, in addition to the computing power that now rival desktops.

Speed transition in Notebook

Speed transition in NotebookThe technology leap from DDR2 to DDR3 doubles system performance. As DDR3 offers superior performance and power savings, notebooks are rapidly adopting DDR3 memory. With rapid transition trend to DDR3, processor makers are also supporting DDR3 platforms up to speed 1333Mbps. Hynix estimates DDR3 1333Mbps portion in notebook will be around 70% at second half of 2010.

DDR3 SDRAM

DDR3 SDRAM, which upholds the next generation main memory standard, can transfer data twice as fast as the current generation DRAM. Hynix¡¯s DDR3 SDRAM boasts high performance and low power consumption. It supports data transfer rate up to 1.6Gb/s and operate at a voltage as low as 1.5V comparable to DDR2 which a previous version of DDR3. Hynix now offers high performance DDR3 in 1Gb and 2Gb densities and is also ready to launch 4Gb in near future. Hynix¡¯s DDR3 also featuring functions such as ZQ calibrations, fly-by topology, dynamic on-die-termination and write levelization to ensure signal integrity and thus higher performance.

DDR3 SDRAM

Key Features of High Speed Interface

Key Features of High Speed Interface

Computing memory Features

Hynix has always been at the leading edge of memory innovation. Hynix is currently supplying 54nm 1Gb/2Gb DDR3 and developing 46nm 1Gb/2Gb DDR3. Hynix offers DDR3 Registered DIMMs which provide higher memory density, speed and memory bandwidth, and reliability for high performance servers. Hynix is also able to provide 1.35V DDR3 RDIMMs for lower power consumption in server platforms.

Main Memory Applications

Main Memory Applications